1. 2. 3. material content data sheet sales product name spa15n60c3 issued 29. august 2013 ma# MA001056032 package pg-to220-3-253 weight* 2135.47 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 8.568 0.40 0.40 4012 4012 leadframe non noble metal iron 7439-89-6 1.431 0.07 670 inorganic material phosphorus 7723-14-0 0.429 0.02 201 non noble metal copper 7440-50-8 1428.770 66.91 67.00 669065 669936 wire non noble metal aluminium 7429-90-5 0.042 0.00 0.00 20 20 encapsulation organic material carbon black 1333-86-4 3.345 0.16 1566 plastics epoxy resin - 130.447 6.11 61086 inorganic material silicondioxide 60676-86-0 535.169 25.06 31.33 250609 313261 leadfinish non noble metal tin 7440-31-5 21.462 1.00 1.00 10050 10050 plating non noble metal nickel 7440-02-0 1.764 0.08 0.08 826 826 solder non noble metal antimony 7440-36-0 0.405 0.02 189 noble metal silver 7440-22-4 1.012 0.05 474 non noble metal tin 7440-31-5 2.630 0.12 0.19 1232 1895 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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